Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change
Summary
Major chipmakers Samsung, TSMC, and Intel are adopting ASML’s newest $400 million high-numerical-aperture (high NA) EUV lithography machines. These machines use advanced laser technology to create smaller, more powerful computer chips, and chipmakers are also updating the stencil size from 6-inch to 12-inch photomasks to boost production by 40%.Key Facts
- Samsung plans to start using ASML’s high NA EUV machines for memory chips by 2028.
- TSMC aims to use this technology for advanced chips from 2030 for clients like AMD, Apple, NVIDIA, and Qualcomm.
- Intel began using high NA EUV machines for its Panther Lake mobile processors starting July 2026.
- ASML machines use extreme ultraviolet light to etch tiny patterns onto silicon wafers, forming computer chips.
- High NA EUV machines have better mirrors and optics to focus laser light more precisely on wafers.
- Samsung, TSMC, Intel, and ASML are switching from 6-inch to 12-inch photomasks to produce chips more efficiently.
- SK Hynix is considering joining the group working on the photomask change and may start using high NA EUV technology by 2028.
- The US and Dutch governments restrict ASML sales of the newest EUV machines to China due to tech competition concerns.
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